Butler Automatic, the inventor and global leader of automatic splicing solutions, announces that it will showcase its SP1 and SP3HSL Automatic Film Splicers at PACK EXPO 2016, to be held November 6-9, 2016, at McCormick Place in Chicago, Illinois. Butler Automatic experts will be on hand in Booth #S-3003 to demonstrate how the film splicers increase efficiency in a wide range of packaging operations by eliminating the packaging line downtime caused by manual film roll changes.